MOLDING METHOD FOR SEMICONDUCTOR PACKAGE,申请号KR20050004707-传众专利搜索

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发明名称	MOLDING METHOD FOR SEMICONDUCTOR PACKAGE
摘要
申请公布号	KR20060083771(A)	申请公布日期	2006.07.21
申请号	KR20050004707	申请日期	2005.01.18
申请人	LG ELECTRONICS INC.	发明人	CHOI, HO SEONG
分类号	H01L23/02	主分类号	H01L23/02
代理机构		代理人
主权项
地址

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