发明名称 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING IT
摘要 <p>A first isolation is formed on a semiconductor substrate, and a first element region is isolated via the first isolation. A first gate insulating film is formed on the first element region, and a first gate electrode is formed on the first gate insulating film. A second isolation is formed on the semiconductor substrate, and a second element region is isolated via the second isolation. A second gate insulating film is formed on the second element region, and a second gate electrode is formed on the second gate insulating film. A first oxide film is formed between the first isolation and the first element region. A second oxide film is formed between the second isolation and the second element region. The first isolation has a width narrower than the second isolation, and the first oxide film has a thickness thinner than the second oxide film.</p>
申请公布号 KR20060083879(A) 申请公布日期 2006.07.21
申请号 KR20060004220 申请日期 2006.01.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YAEGASHI TOSHITAKE;SHIOZAWA JUNICHI
分类号 H01L27/115 主分类号 H01L27/115
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