| 摘要 |
Thermosetting material (T) with improved shock resistant property comprises a thermosetting resin (R) (20-99 wt.%) and a shock modifier (1-80 wt.%) comprising a copolymer of P1-P2-P3 or P1-P2 blocks, where the block is bonded to one another by a covalent bond or by an intermediate molecule bond the blocks successively by a covalent bond. Thermosetting material (T) with improved shock resistant property comprises a thermosetting resin (R) (20-99 wt.%) and a shock modifier (1-80 wt.%), comprising a copolymer of P1-P2-P3 or P1-P2 blocks, where the block is bonded to one another by a covalent bond or by an intermediate molecule bonded to the blocks successively by a covalent bond, P1 comprises methyl methacrylate copolymer and a water-soluble monomer, P3 is polymethylmethacrylate homopolymer/copolymer (optionally comprising a water-soluble monomer or a polymer of vinyl monomer(s), P2 is incompatible or partially compatible with (R), incompatible with P1 and optionally with P3, and P2 has a glass transition temperature (Tg) lower than the temperature of (T).
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