| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a BGA package having a half-etched bonding pad and a cut plating line which has excellent electric properties, and in which the bending of a mold does not occur and a solder ball is not separated from the pad during a drop test, and to provide a manufacturing method therefor. <P>SOLUTION: The BGA package comprises a first external layer that includes a circuit pattern 803a, a wire bonding pad pattern, and a chip 820 that is wire-bonded to a wire bonding pad; a second external layer that includes a circuit pattern, a cut plating line pattern, a half-etched uneven solder ball pad pattern, and a chip mounted to a solder ball pad; and an insulating layer having a continuity hole that is interposed between the first and the second external layers for electrical conduction between the first and the second external layers. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
