| 摘要 |
<P>PROBLEM TO BE SOLVED: To use a lead-free solder for die bonding. <P>SOLUTION: A stress buffering plate 8 is placed between a semiconductor chip 1 and a die pad 4 made of a Cu alloy. The semiconductor chip 1 and the stress buffering plate 8, and the stress buffering plate 8 and the die pad 4 are joined by joining materials 10 and 9 of lead-free solder wherein its solid phase temperature is 270°C or higher, its liquid phase temperature is 400°C or lower, and its main constituent elements are Sn, Sb, Ag and Cu. Thus, the lead-free solder can be used for die bonding without generating cracks of chips. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
