发明名称 SUBSTRATE PROCESSING UNIT AND SUBSTRATE PROCESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing unit that can quickly and easily remove physical films and a substrate processing method therefor. SOLUTION: This substrate processing unit comprises a loading portion for loading a substrate formed with physical films, a dry ice supply portion for providing dry ice particles or carbonic anhydride, a spray portion for spraying the dry ice particles supplied from the dry ice supply portion via one or more nozzles or solidifying the carbonic anhydride and spraying it onto the substrate for primary surface treatment of the physical films and a surface treatment portion for selectively removing the physical films subjected to primary surface treatment. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006191022(A) 申请公布日期 2006.07.20
申请号 JP20050358120 申请日期 2005.12.12
申请人 KC TECH CO LTD 发明人 KIM SEKO;PARK SHOSHU;YOON CHEOL-NAM
分类号 H01L21/304;H01L21/027;H01L21/306 主分类号 H01L21/304
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