| 摘要 |
To provide an electroforming mold for manufacturing a multi-step structure minute component and a method for manufacturing the same, for which height control is possible and manufacturing process does not become complicated. On the upper face of a film of an electroconductive layer 2 formed on the upper face of a substrate 1 , a resist 3 is formed in which a first soluble portion 3 b and a first insoluble portion 3 a are formed. Next, a light-absorbing body 10 is formed on the upper face of the resist, exposure and development are carried out, in addition a film of an electroconductive layer 2 is formed on the upper face thereof, and a light-absorbing body 10 and an electroconductive layer 5 on the upper face of the light-absorbing body 10 are removed by liftoff. Further, a resist is formed on the upper face thereof, in which a second soluble portion 6 b and a second insoluble portion 6 a are formed. Next, the first resist and the second resist are developed to remove the first soluble portion 3 b and the second soluble portion 6 b, thereby giving an electroforming mold 101 having an electroconductive layer on the basal part of respective steps.
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