| 摘要 |
PURPOSE: A flip chip arrangement and a method for arranging a filp chip are provided to reduce a manufacturing cost by eliminating a solder tin forming operation on a pad of a semiconductor device. CONSTITUTION: A flip chip arrangement includes a plurality of outer connectors(23) which are arranged on one surface of a semiconductor device and electrically coupled with an interconnection pattern(3) on a substrate via a solder tin(13). An insulating material layer(9) having an aperture(9c) corresponding at least to the outer connector is formed on an interconnection forming region of the substrate. The outer connector and the interconnection pattern are electrically coupled with each other via the solder tin formed in the aperture. |
