| 摘要 |
PROBLEM TO BE SOLVED: To prevent the generation of adhesive particles from a dicing tape during the dicing of a wafer. SOLUTION: The dicing tape 10 is stuck on the rear of the wafer 1 to which an ink supply port 3 is opened, and the wafer is diced. Treatment in which the adhesion of the dicing tape 10 is lowered selectively at a site where the ink supply port 3 is exposed for the wafer 1 is conducted through a light-shielding mask M before the dicing by a dicing blade B, and an adhesive layer 12a is formed previously in which adhesive power is lowered. Even if an impulse by cutting water W penetrated to the ink supply port 3 from an orifice for a nozzle layer 2 during the dicing, an air blow or the like is applied, a trouble such as the clogging of the orifice is not generated because the adhesion is lowered in the particles generated by the peeling of the adhesive layer 12a. COPYRIGHT: (C)2006,JPO&NCIPI |
