| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a rectangular conductor and a lead wire excellent in conductivity, with small thermal stress when connecting it by soldering. <P>SOLUTION: The rectangular conductor 10 is constituted of a clad material formed by arranging thin plate materials for conductors 12a, 12b on both surfaces of a core-use thin plate material 11. The thin plate materials for conductor 12a, 12b have a volume resistivity of 25(×10<SP>-3</SP>μΩm) or less, and the core-use thin plate material 11 has a 0.2% proof stress smaller than that of the thin plate materials for the conductors 12a, 12b and a volume resistivity of 30(×10-3μΩm) or less. The 0.2% proof stress of the whole clad material is 120 MPa or less. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
