| 摘要 |
PROBLEM TO BE SOLVED: To provide a projection for external connection having a high aspect ratio and capable of reducing the quantity of metal material used, and to provide its forming method, a semiconductor chip, a circuit board and an electronic apparatus employing it. SOLUTION: The projection 20 for external connection is provided with a resin projecting body 22 contiguously to an electrode pad 14, and a metal conductive body 24 is formed to straddle over the electrode pad 14 and the projecting body 22. With such an arrangement, a projection for external connection having a high aspect ratio can be formed easily. COPYRIGHT: (C)2006,JPO&NCIPI
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