发明名称 STIMULATION-PEELABLE ADHESIVE COMPOSITION, METHOD FOR BONDING AND PEELING MEMBER USING STIMULATION-PEELABLE ADHESIVE COMPOSITION, SURFACE PROTECTION FILM, METHOD FOR PROTECTING SURFACE OF OBJECT TO BE PROTECTED AND SURFACE PROTECTION LAYER
摘要 PROBLEM TO BE SOLVED: To provide a stimulation-peelable adhesive composition which is applied between two substrates and can firmly bond the two substrates by the irradiation of light, thereby exhibiting excellent adhesiveness, while the two bonded substrates can be easily peeled off as necessary by providing stimulation such as light and heat, and to provide a method for bonding and peeling substrates using the stimulation-peelable adhesive composition, a surface protection film, a method for protecting the surface of an object to be protected and a surface protection layer. SOLUTION: The stimulation-peelable adhesive composition comprises a photo-curable resin, a photoinitiator and a gas generating agent for generating gas by stimulation. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006188586(A) 申请公布日期 2006.07.20
申请号 JP20050000817 申请日期 2005.01.05
申请人 SEKISUI CHEM CO LTD 发明人 SHICHIRI NORISHIGE
分类号 C09J4/00;C09J5/00;C09J7/02;C09J11/00;C09J201/02 主分类号 C09J4/00
代理机构 代理人
主权项
地址