发明名称 Ti precursor, method of preparing the same, method of preparing Ti-containing thin layer by employing the Ti precursor and Ti-containing thin layer
摘要 A Ti-precursor for forming a Ti-containing thin layer represented by the formula I below, a method of preparing the same, a method of preparing a Ti-containing thin layer by employing the Ti-precursor and the Ti-containing thin layer are provided: wherein X<SUB>1 </SUB>and X<SUB>2 </SUB>are independently F, Cl, Br or I; n is 0, 1, 2, 3, 4 or 5; m is 0, 1, 2, 3, 4, 5, 6 or 7; and R<SUB>1 </SUB>and R<SUB>2 </SUB>are independently a linear or branched C<SUB>1-10 </SUB>alkyl group. The Ti precursor for forming the Ti-containing thin layer can be deposited at a deposition temperature of approximately 150° C.~200° C., and a Ti-containing thin layer with a high performance character can be prepared.
申请公布号 US2006157861(A1) 申请公布日期 2006.07.20
申请号 US20050282486 申请日期 2005.11.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK SUNG-HO;LEE JUNG-HYUN
分类号 H01L21/44;H01L23/48 主分类号 H01L21/44
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