Structure and method for joining a semiconductor package to a substrate using solder column

摘要

In one embodiment, a semiconductor package and a package mounting substrate are joined using a conductive material column such as a solder column. Each of the semiconductor package and the package mounting substrate include an insulating protective opening exposing a wiring layer therein. The solder column resides within the insulating protective openings to electrically couple the wiring layers. By forming the insulating protective openings with sufficient depth, each protects the solder column against stress faults and thereby forms more reliable electrical connections and supports high-density electrical connections between the semiconductor package and the package mounting substrate.