ON-CHIP CIRCUIT PAD STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an on-chip circuit pad used on a lossy substrate to improve substrate induced losses.

SOLUTION: A shielded circuit pad is provided where parasitic capacitance is controlled by the inclusion of a shunt transmission line stub which reduces the substrate induced loss in millimeter-wave application. The circuit pad is located on the substrate with a shield located beneath the circuit pad, and the shunt transmission line stub attached to the circuit pad. Accordingly, controlled impedance is obtained for the millimeter-wave application. The space between the circuit pad and the shield may then be minimized.

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