发明名称 SUBSTRATE POLISHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate polishing device of a compact constitution occupying a reduced area and capable of being stably operated with suppressing vibration of a drive shaft. <P>SOLUTION: The substrate polishing device is equipped with a polishing table 48 having a polishing plate 50 and the drive shaft 68 connected eccentrically with the polishing table 48 and causing the polishing table 48 to make translational and circular motion integrally with the polishing plate 50. The size of the polishing table 48 is designed to be almost equal to the substrate to be polished, and a plurality of polishing liquid jetting holes 50a communicating with a space 78 formed between the polishing plate 50 and the polishing table 48 are formed inside the polishing plate 50. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006187863(A) 申请公布日期 2006.07.20
申请号 JP20060064395 申请日期 2006.03.09
申请人 EBARA CORP 发明人 ITO KENYA;AIZAWA HIDEO
分类号 B24B37/00;B24B37/07;B24B37/12;B24B47/12;B24B57/02;H01L21/304 主分类号 B24B37/00
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