发明名称 Method for manufacturing semiconductor device
摘要 A method for manufacturing a semiconductor device is provided in which it is possible to perform process control taking account of wafer information and to deal with the process control in which a recipe is change from one wafer to another. The method comprises steps of inserting a process control system into the path of a network where a manufacturing execution system (MES) and a manufacturing apparatus are connected with each other by using a LAN, obtaining a process result on the lot of the wafers at a previous step through the use of the process control system to rewrite the process recipe, and transmitting the rewritten process recipe from the process control system to the manufacturing apparatus. Since the method includes the step of obtaining the process result on the lot effected at the previous step as wafer information, it is possible to calculate a control parameter taking account of the state of the wafers. Also, since a process control (APC) system is inserted between the MES and the apparatus, there is no communication between the MES and the APC system, so that a communication burden is reduced, thereby the process control can be performed from one wafer to another.
申请公布号 US2006161288(A1) 申请公布日期 2006.07.20
申请号 US20050305074 申请日期 2005.12.19
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 IMAI SHINICHI
分类号 G06F19/00;H01L21/02;H01L21/3065 主分类号 G06F19/00
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