CHEMICAL MECHANICAL POLISHING PAD FOR CONTROLLING POLISHING SLURRY DISTRIBUTION,申请号KR20060001188U-传众专利搜索

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发明名称	CHEMICAL MECHANICAL POLISHING PAD FOR CONTROLLING POLISHING SLURRY DISTRIBUTION
摘要
申请公布号	KR200421911(Y1)	申请公布日期	2006.07.20
申请号	KR20060001188U	申请日期	2006.01.14
申请人		发明人
分类号	H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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