| 摘要 |
PROBLEM TO BE SOLVED: To provide a baking apparatus of a semiconductor wafer. SOLUTION: The baking apparatus of a semiconductor wafer comprises a hot plate, a vessel whose upper part is opened for the hot plate to be installed, and a cover to cover the upper part of the vessel. The cover comprises an upper plate and a lower plate between which a gas flow space is provided to face to each other, and a side wall of a specified height provided to an edge between them. The side wall is provided with at least one gas inlet, and a plurality of gas supply holes are provided in the central region of the lower plate. The lower edge of the cover is connected to a skirt of specified height to which a gas exhausting part is provided. COPYRIGHT: (C)2006,JPO&NCIPI
|
