| 摘要 |
PROBLEM TO BE SOLVED: To provide an ultrathin multilayer printed wiring board where a film is set to be a base material, handling property of the film can be maintained, industrial production can easily be performed, a circuit pattern can stably be formed, and a plurality of ultrathin printed wiring boards and printed wiring boards of minute wiring are laminated. SOLUTION: In the printed wiring board of a film base, the wiring pattern with line width of 7μm or below, interline gap of 8μm or below, and thickness of 5μm or below is formed on one face or both faces of a high polymer film (preferably polyimide film and polyimide benzo oxazole film). its modulus of elongation is 6 GPa or above, thickness is 10μm or below, and glass dislocation temperature is 150°C or above. COPYRIGHT: (C)2006,JPO&NCIPI |
