| 摘要 |
Methods of fabricating a printed circuit and printed circuits, including a method comprising: (a) depositing a conductive material to form a first conductive pathway upon a substrate; (b) depositing a dielectric material directly over at least a first portion of the conductive pathway utilizing an electrophotographic process; and (c) depositing a conductive material over at least a portion of the dielectric material to form a second conductive pathway, where the second conductive pathway is in electrical communication with the first conductive pathway.
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