Method for attracting glass substrate with electrostatic chuck and electrostatic chuck

摘要

The present invention relates to a method for using an electrostatic chuck which can achieve clamping force of 100 gf/cm² within 60 seconds at low voltage of ±1 kV or less compared to high voltage of the conventional art such as 3 kV or 10 kV for electrostatically clamping a glass substrate. There is provided a method for clamping a glass substrate with an electrostatic chuck having a dielectric layer in which the upper surface of the dielectric layer of the electrostatic chuck has a surface roughness Ra of 0.8 mum or less and the volume resistivity of the dielectric layer of the electrostatic chuck is 10⁸-10¹² Omegacm, comprising the steps of increasing the temperature of the glass substrate so as to change the volume resistivity of the glass substrate to be 10¹⁴ Omegacm or less, and clamping the glass substrate to the upper surface of the dielectric layer of the electrostatic chuck.