| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of solder packaging a connector assembly and a connector in a rectangular form which is made for a warpage generated in a terminal support not to influence the terminal support of other sides, and which can aim at an improvement in the packaging density of a substrate in the rectangular form. SOLUTION: The connector assembly 10 includes a supporting frame 20 for the assembly having a rectangular frame 21, and four connectors 30 arranged along with the frame 21 in the rectangular form on the one side surface of the frame 21 of the supporting frame 20 for the assembly. Each of the four connectors 30 has a rod-like terminal support 31, and a plurality of terminals 32 which are mounted in the intermediate part of the terminal support 31. The ends of the terminal support 31 of each connector 30 are engaged attachably and detachably with the engaging part 215 provided in the corner of the frame 21 of the above supporting frame 20 for assembly, and the supporting frame 20 for the assembly and the four connectors 30 are integrated. The engagement of the engaging part 215 of the above corners and the end of the above terminal support 31 can be separated in the separating direction of the supporting frame 20 and the connector 30 with each other. COPYRIGHT: (C)2006,JPO&NCIPI |
