发明名称 Circuit modeling and selective deposition
摘要 A process for fabricating an electrical component using an ink-jet printing process is provided. The process includes the steps of selecting at least one electronic ink having at least a first functionality when cured; determining a positional layout for a plurality of droplets of the electronic ink(s) such that, based at least on the first functionality, the positional layout provides a desired response for the electrical component; providing at least a first characteristic that relates to the electrical component; comparing the determined positional layout to at least one corresponding entry in a lookup table of empirical data relating to the first characteristic and to the determined positional layout; adjusting the determined positional layout accordingly; and printing each of the droplets of the electronic ink(s) onto a substrate according to the adjusted positional layout. The step of determining a positional layout may include determining a volume of ink to be deposited.
申请公布号 US2006158478(A1) 申请公布日期 2006.07.20
申请号 US20060331188 申请日期 2006.01.13
申请人 HOWARTH JAMES J;EDWARDS CHUCK;VANHEUSDEN KAREL 发明人 HOWARTH JAMES J.;EDWARDS CHUCK;VANHEUSDEN KAREL
分类号 B41J29/393 主分类号 B41J29/393
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