发明名称 Heat dissipation device with a heat pipe
摘要 A heat dissipation device includes a heat conducting base, a heat sink on the base and two heat pipes thermally contacting with the heat sink and the base. The heat sink is made of metal extrusion and includes a heat conducting cylinder at a periphery of the heat sink and a plurality of fins extending from and surrounded by the cylinder. The cylinder includes four interconnected sides. The fins of the same side are parallel to each other. The two heat pipes thermally surround the cylinder of the heat sink and wholly contact the heat sink.
申请公布号 US2006158850(A1) 申请公布日期 2006.07.20
申请号 US20050244688 申请日期 2005.10.06
申请人 FOXCONN TECHNOLOGY CO., LTD. 发明人 LEE HSIEH-KUN;CHEN CHUN-CHI;ZHOU SHI-WEN;WU ZHAN;ZHOU BING-WEN;DU HONG-WEI
分类号 H05K7/20 主分类号 H05K7/20
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