发明名称 PUNCHING METHOD FOR FLEXIBLE PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To discharge the punching dusts of a flexible printed board from a lower die taper part one after another without flying out the dust on the surface of the lower die, even when using a die having a stroke so short that a punching-through punch inserted in the die does not reach a position, where it projects to the lower die taper part from its punch holeat the shape work such as removal of blind through-holes or unused portions of a flexible printed board. SOLUTION: A flexible printed board 14 has circular lands formed on both sides of an insulation layer 17 with copper foils 16a, 16b. When punching a portion surrounded by the dashed line A, the copper foil of a part 18 inside the dashed line A is previously etched to expose the insulation layer 17. A dashed line A part is punched by a punching-through punch to make the inside portion 18 of the punching dust easy to bend, as this portion is of only the insulation layer 17. This relaxes the repulsion force of the punching dust and the lower die to prevent the dust from flying out of the lower die. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006190835(A) 申请公布日期 2006.07.20
申请号 JP20050001738 申请日期 2005.01.06
申请人 NIPPON MEKTRON LTD 发明人 OKAMOTO HIROHIKO;YAMAGUCHI KEISUKE;SHINOHARA YUICHI;SUZUKI KENJI
分类号 H05K3/00 主分类号 H05K3/00
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