发明名称 Metal junction diode and process
摘要 A junction diode includes a substrate having first and second cathode regions separated by an anode region. Metal silicide layers contact the first and second cathode regions and the anode regions. The anode region has a doping concentration sufficient to create a depletion region in the anode region adjacent to the metal silicide layer contacting the anode region. A fabrication process includes forming the anode region to have a doping concentration that increases in a direction into the anode region away from the substrate surface.
申请公布号 US2006157748(A1) 申请公布日期 2006.07.20
申请号 US20050038998 申请日期 2005.01.20
申请人 CHONG NUI;OMID-ZOHOOR FARROKH 发明人 CHONG NUI;OMID-ZOHOOR FARROKH
分类号 H01L29/76 主分类号 H01L29/76
代理机构 代理人
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