| 发明名称 |
Multi-surface IC packaging structures and methods for their manufacture |
| 摘要 |
An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
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| 申请公布号 |
US2006157846(A1) |
申请公布日期 |
2006.07.20 |
| 申请号 |
US20060353564 |
申请日期 |
2006.02.13 |
| 申请人 |
FJELSTAD JOSEPH C;SEGARAM PARA K;OBENHUBER THOMAS J;GRUNDY KEVIN P;OBENHUBER INESSA |
发明人 |
FJELSTAD JOSEPH C.;SEGARAM PARA K.;OBENHUBER THOMAS J.;GRUNDY KEVIN P.;OBENHUBER INESSA |
| 分类号 |
H01L23/52;H01L;H01L21/56;H01L23/31;H01L23/48;H01L23/495;H01L23/498 |
主分类号 |
H01L23/52 |
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