FLIP-CHIP SEMICONDUCTOR PACKAGES AND METHODS FOR THEIR PRODUCTION

摘要

A semiconductor package (1, 23, 35) includes a semiconductor chip (2, 27) having an active surface (4) with integrated circuit structures and chip contact pads (6) and a passive surface (5). The chip contact pads (6) are disposed on the active surface (4) in a flip-chip arrangement. The active surface (4) and passive surface (5) lie in essentially parallel planes. The semiconductor chip (2, 27) also has side faces (7, 28, 50) which are located between the active (4) surface and passive surface (5). The active surface (4) of the semiconductor chip (2, 27) is laterally smaller than the passive surface (5).