| 发明名称 |
Hitzeempfindlicher Klebstoff |
| 摘要 |
A heat-sensitive adhesive material having a substrate and a heat-sensitive adhesive layer which is provided on the substrate and which contains a thermoplastic resin and a solid plasticizer having a molecular weight of 250 to 550 and a melting point of 95 to 160 DEG C. |
| 申请公布号 |
DE60305746(D1) |
申请公布日期 |
2006.07.20 |
| 申请号 |
DE2003605746 |
申请日期 |
2003.01.10 |
| 申请人 |
RICOH CO., LTD. |
发明人 |
IKEDA, TOSHIAKI;KUGO, TOMOYUKI |
| 分类号 |
C09J7/02;C08K5/00;C08K5/07;C08K5/12;C08K5/18;C08K5/47;C09J7/04;C09J11/08;C09J201/00 |
主分类号 |
C09J7/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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