MEMS PACKAGING WITH IMPROVED REACTION TO TEMPERATURE CHANGES

摘要

A large-scale MEMS device (10, 100, 200, 300) includes a MEMS die (22) supported by at least one compliant die mount (28). The compliant die mount (28) couples the MEMS die (22) to a support structure (20). The support structure (20) is positioned within a package (38, 40) . In accordance with an aspect of the invention, the package (38, 40) is substantially symmetrical about the MEMS die (22). In accordance with another aspect of the invention, the support structure (20) and/or the package (38, 40) is designed to have a neutral bend axis along the MEMS die (22).