| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a copper-clad laminate which can correspond to fine patternization impossible for a conventional copper-clad laminate for a substrate, solves problems including insufficient peel strength, foaming, and peeling during heating, and is useful as a material for a polyimide substrate. <P>SOLUTION: In the copper-clad laminate, copper foil 1-8μm in thickness with a heat resistant carrier 10-22μm in thickness is laminated directly on at least one side of a polyimide layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
