Member having plasma-resistance for semiconductor manufacturing apparatus and method for producing the same

摘要

In order to control and reduce generation of disjoined grains from a plasma-resistant member, the present invention provides a plasma-resistant member having no pores and boundary layers. In a layer structure made of yttria polycrystal and formed on a surface of a member for a semiconductor manufacturing apparatus on a side exposed to plasma, substantially no hyaline boundary layer exists in the yttria polycrystal. With this, corrosion from a boundary layer never progresses even in a plasma atmosphere. It is also possible to control and reduce disjoined grains due to such corrosion.