Cooling structure of solid state and formation thereof with integrated package

摘要

A cooling structure of solid state applied to a heat source has a module of thermoelectric transfer and a module of thermo transfer including two structures of passive cooling connected and attached the module of thermoelectric transfer, respectively. One structure of first structure of passive cooling is near heat source and heat generated by the heat source is transferred to another structure of passive cooling through the one structure passive cooling and the module of thermoelectric transfer when electrical power is employed to the module of thermoelectric transfer.