发明名称 |
SUBSTRATE HEATING DEVICE, VACUUM DEVICE AND SUBSTRATE HEATING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate heating device where the temperature of a substrate is raised at high speed while suppressing substrate deformation to be small and making uniform the temperature of a whole face of the substrate in a short time even in the large substrate. <P>SOLUTION: The substrate heating device has soaking plates 5 and first heaters 1. The soaking plates 5 are arranged in a cabinet 10, and have first faces 9. The substrate 4 is made close to the first faces 9 and can be held. The first heaters 1 are disposed in the cabinet 10 and face the first faces 9. When the substrates 4 are held in the first faces 9, the substrates 4 can be heated. The soaking plates 5 are formed of materials having thermal conductivity higher than those of the substrates 4. The soaking plates 5 may have second heaters 20 heating the soaking plates 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
申请公布号 |
JP2006190731(A) |
申请公布日期 |
2006.07.20 |
申请号 |
JP20050000197 |
申请日期 |
2005.01.04 |
申请人 |
MITSUBISHI HEAVY IND LTD |
发明人 |
SASAGAWA EISHIRO;OTSUBO EIICHIRO;MORI TADASHI |
分类号 |
H01L21/205;C23C14/50;C23C16/46;H01L31/04 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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