| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad which allows highly accurate optical terminal point detection in a polishing state and can prevent slurry from leaking even when used for a long period of time, and a method for manufacturing a semiconductor device using the polishing pad. <P>SOLUTION: The polishing pad has the following constitution. A polishing layer 11, which has a polishing region 9 and a light transmitting region 8, and a cushion layer having an opening part 13 smaller than the light transmitting region are laminated so that the light transmitting region and the opening part are overlapped with each other. An annular water impermeable elastic member 16, which covers a contact part of the rear face 14 of the light transmitting region with the cross section 15 of the opening part, is provided to the contact part. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
