| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode package having an excellent heat dissipation property in an easy manufacturing process. <P>SOLUTION: The light emitting diode (LED) package and its manufacturing process include a silicon-on-insulator (SOI) equipped with two silicon base materials and an insulating layer interposed therebetween. In order to divide the silicon-on-insulator substrate into a contact surface of a positive electrode and a negative electrode, the two silicon base materials of the silicon-on-insulator substrate are etched respectively to form a reflection cavity and an insulating trench. Then, a plurality of metal lines are formed for electrically connecting the two silicon base materials. It is hereby possible to mount an LED chip on the reflection cavity and electrically connect the LED chip to a corresponding electrode of the insulator substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
