FILL PLATED STRUCTURE OF INNER VIA HOLE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a fill plated structure of an inner via-hole in which a plating process is simplified while the heat conductivity of a substrate is increased, and to provide a manufacturing method thereof. SOLUTION: A fill plated structure of an inner via-hole, which includes an electroless plated layer 63 formed on a copper clad laminate having an inner via-hole formed therethrough, a first copper electroplated layer 64 formed on the electroless plated layer on the copper clad laminate and formed on an inner wall of the via-hole to form a belly portion having a belly shape, and a second copper electroplated layer 65 formed on the first copper electroplated layer of a surface of the copper clad laminate and formed on upper and lower portions of the first copper electroplated layer of the inner wall of the via-hole to fill the via-hole. COPYRIGHT: (C)2006,JPO&NCIPI