| 摘要 |
An apparatus minimizes stress on un-moulded IC devices ( 4 ) by use of an airflow system. A vacuum urges the DUT's into contact with the pivoted test fingers, thereby reducing damage to the IC ( 4 ). A fitting ( 5 ) is connected to a vacuum pump which draws out air and creates a vacuum chamber in the area created by the lift/support ( 8 ) and the test socket ( 16 ), thereby causing the supported un-moulded DUTs ( 4 ) to move upward towards the test socket ( 16 ) and into physical contact with the test pins ( 16 ). The index time is decreased in order to improve overall operating efficiency and costs of the said test apparatus ( 1 ).
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