| 摘要 |
Processes for planarizing a substrate, for encapsulating a printed electronic feature and for forming a ramp feature. In various embodiments, the processes include the steps of: (a) applying a planarizing agent, an encapsulating agent or a ramping feature to a substrate or to an electronic feature disposed thereon, preferably through a direct write printing process, e.g., ink-jet printing, and (b) treating the applied agent under conditions effective to form a planarizing feature, an encapsulation layer or a ramping feature. |
