| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for splitting a substrate capable of completely splitting and cutting all planned cutting lines set on the substrate without leaving any cutting lines uncut when the substrate is split by an expand-break method, and a liquid ejection head. SOLUTION: The planned cutting line L1 is set on the surface 37 of a silicon wafer, a plurality of through holes 40 are formed along the planned cutting line, and sections between the adjacent through holes 40 are formed to constitute weak sections 48. The planned cutting line located more outwardly of the silicon wafer has a width W in the planned cutting line direction of the weak section 48 narrower than that of the planned cutting line located inwardly so that priority is given to the planned cutting line L1 located more outwardly in cutting when the substrate is split by the expand-break method. COPYRIGHT: (C)2006,JPO&NCIPI |
