| 发明名称 |
IMAGE SENSOR IN WHICH LIGHT RECEIVING REGION IS EXTENDED AND METHOD OF MANUFACTURING THE SAME |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an image sensor securing at a maximum a light receiving region occupying an image sensors chip, and also to provide the method of manufacturing the same. <P>SOLUTION: There is provided an image sensor in which a light receiving element arranged on a first substrate (101) and a peripheral circuit arranged on a second substrate (200) are integrated in a 3-dimensional structure. The first substrate (101) and the second substrate (200) are bonded via bonding pads (111A-111C and 206A-206C) arranged on the front surfaces. The topmost part of the back surface of the first substrate (101) comprises micro lens (114). <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
| 申请公布号 |
JP2006191081(A) |
申请公布日期 |
2006.07.20 |
| 申请号 |
JP20050376976 |
申请日期 |
2005.12.28 |
| 申请人 |
MAGNACHIP SEMICONDUCTOR LTD |
发明人 |
BOKU SHOKIN |
| 分类号 |
H01L27/14;H01L27/146;H01L31/10 |
主分类号 |
H01L27/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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