| 摘要 |
PROBLEM TO BE SOLVED: To improve a packing ratio of a corundum into a matrix resin and handling properties and moldability of a resin composition by imparting low viscosity and uniform dispersibility to a kneaded product and improving a curing rate when using a curable resin as the matrix resin. SOLUTION: The present invention provides a corundum coated with a silicone compound containing a silicone resin, a resin composition containing the corundum, and an electronic device or semiconductor element using the resin composition. The silicone resin comprises preferably at last one kind of modified silicone in which a part of methyl groups of polydimethylsiloxane is substituted by other substituent group X (X is an organic group having an alkoxy group, an epoxy group, an amino group, a carboxy group, an ether bond or the like) and a modified silicone represented by formula (1) äwherein Y is an alkyl group represented by the formula C<SB>n</SB>H<SB>2n+1</SB>(n is an integer of 1-8); m is an integer of≥1}. COPYRIGHT: (C)2006,JPO&NCIPI |
