| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for the composite molding of a base material for an electronic product, which solves a problem that a defective ratio is high when a casing of the base material for the electronic product is manufactured in a conventional single process and another problem that a mold cost is high and delicate patterns cannot be produced when the casing of the base material for the electronic product is manufactured in a conventional pressing process. SOLUTION: The invention relates to the method for the composite molding of the base material for the electronic product which is used for molding the casing of the electronic product. First the base material to be molded is provided and is preformed by a conventional process such as hydrostatic forming, casting or pressing. Then, the preformed base material is placed in a mold and a metal pressure plate is put on the preformed base material so that the preformed base material is pressed. One electromagnetic coil set for the preformed base material is impressed with a pulsed current and is made to approach and touch the preformed base material so that the preformed base material is subjected to outward deformation due to tension between the electromagnetic coil and the preformed base material and is elongated, producing repulsion force to fit it tightly into the mold. COPYRIGHT: (C)2006,JPO&NCIPI
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