PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RELIEF PATTERN AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of giving a polyimide film by a low-temperature process, a pattern forming method using the photosensitive resin composition, and a semiconductor device with a film produced from the photosensitive resin composition.

SOLUTION: The photosensitive resin composition for forming a polyimide pattern on a substrate comprises (a) a polyamic acid, (b) a photobase generator which generates a secondary amine having at least one substituent in the α position upon irradiation with an actinic ray, and (c) a solvent.

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