发明名称 METHOD FOR MEASURING DEPOSITION THICKNESS AND DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a method for measuring deposition thickness by which deposition thickness on a substrate is accurately converted from a deposition rate of an organic gaseous material effused from a vertically moving deposition source, and to provide a deposition system using the same. SOLUTION: The method for measuring the deposition thickness includes: sensing a deposition rate of a material effused from the deposition source 20 to the substrate 30, the sensing being conducted by a deposition rate measuring sensor 26; transmitting the sensed deposition rate to a controller; and calculating the deposition thickness on the substrate 30 using a conversion formula that employs the sensed deposition rate and the life value of the deposition rate measuring sensor 26 as parameters. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006188762(A) 申请公布日期 2006.07.20
申请号 JP20050370950 申请日期 2005.12.22
申请人 SAMSUNG SDI CO LTD 发明人 HWANG MIN JEONG;LEE SEIKO
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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