| 摘要 |
The invention relates to a micro-scale cooling element ( 1 ) having a mounting surface ( 2 ) for a constituent part, in particular a semiconductor component, that is to be cooled, which element is configured, in particular, cuboidally and has in the interior a micro-scale cooling structure ( 3 ) that is connected via connecting conduits ( 4 ) to at least one inflow opening ( 5 ) and at least one outflow opening ( 6 ) through which a cooling medium is conveyable to and dischargeable from the micro-scale structure ( 3 ), the micro-scale cooling element having a monolithic structure.
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