| 摘要 |
An electronic component package tape comprising a carrier tape of belt-like form storing electronic components in storage pockets formed into a concaved box shape at predetermined pitches, a cover tape of ribbon-like form bonded to the carrier tape to seal upper openings of the storage pockets, and first protrusions, each having a tip of rounded surface formed on an underside surface of the cover tape facing the electronic components. The storage pockets may be provided with a second protrusion formed in an upwardly protruding manner on a bottom surface thereof. In a method of manufacturing the electronic component package tape, the cover tape is held between a first and a second rotating bodies. Both of the rotating bodies are rotated to form protrusions on the cover tape, which is bonded to an upper surface of the carrier tape in a manner to cover openings of the storage pockets.
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