| 摘要 |
The invention relates to a sensor module, in particular a measured-value pickup ( 2 ) for determining measurement data and a circuit arrangement ( 3 ) for enabling a wire-free power supply and interrogation of the measurement data. The measured-value pickup is formed as an integrable sensor ( 2 ), and the circuit arrangement is formed as an integrated semiconductor circuit module ( 3 ), the sensor ( 2 ) and the semiconductor circuit module ( 3 ) being mechanically and electrically conductively connected to one another to form an integrated sensor chip unit ( 1 ) using microsystems engineering means. |
