| 摘要 |
<p>The present invention relates to a plate radiator of a heat pipe type, which includes an enclosed tabulate shell made of metal sheets. The inner hollow chamber of said shell is vacuum and a liquid medium, which possesses a characteristic of evaporating while absorbing heat, is infused therein. An end face for absorbing heat by being coated on the surface of an electronic component which radiates heat is prefabricated on the outside of the bottom of said shell for absorbing heat. A support component is provided in the inner hollow chamber of said shell and it is connected fixedly with an inner surface of the shell. With the above arrangement the deformation of the shell caused by atmospheric action or pressure created by evaporation of said liquid medium in said chamber is avoided. The principle of heat pipe effect is applied to the present invention, and the inner and outer structure of said tabulate shell is reinforced. As a result, an effective solution is provided for resolving the problem of dissipating heat from super large-scale integrated circuits.</p> |
